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PREPARED BY:
DATE:
I
1 SPEC.No.
Ix996047
ELECTRONIC
COMPONENTS
GROUP
SHARP CORPORATION
I
SPiXIFICATION
DEVICE SPECIFICATION FOR
Opto-Ekctronic
Devices Division
Light Emitting Diode
MODEL No.
GL6ZS27
1
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharps consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers r If the use of the prcxluct in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers * Rescue and security equipment [ * Other safety equipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) C * Nuclear power control equipment * lMedica1 equipment (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: , M.Katoh, Department General Manager of Engineering Dept.,J.II Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION /
1
1
CUSTOMER'S
APPROVAL
DATE:
BY:
DG996047 MODELa No.
Jurd16/!w
PAGE
I
GL6ZS27
l/10
GL6ZS27 Swcifkation
1. Application This specificationappliesto the light emitting diode &vice Model No. GL6ZS27. [AlGalnP (dicing or scribe/braketype) Sunset-orangeLED device1
2. Outline dimensions pin co~ections and
. . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheet Page2.
. 3. Ratingsandcharacteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*....... 3- 1. Absolute maximumratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. CharacteristicsDiagram
Refer to the attachedsheet Page3-4.
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4- 1. Test itemsand testconditions 4-2. Measurement itemsand Failurejudgementcriteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a Refer to the attachedsheetPage6. 5- 1. Applied standard 5-2. Samplingmethodandlevel 5-3. Test items,judgementcriteria andclassificaof defect 54. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria and classificaof defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-1. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environment
7. ~ecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPageg-10. 7-l. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions 7-4. For cleaning
Dci996047
MODEL No.
I Jun/16/99
PAGE
I
I
3. Ratingsandcharacteristics 3- 1. Absolutemaximumratings Symbol -. Parameter P Power dissipation (Ta=25"C) Unit mW
GL6ZS27
I
3110
I Value 130
Storagetemperature 1 Tstg 1 -40 100 1 "C soldering temperature(Note 1 Tsol 2) 1 26O(within5 seconds) I "C (Note 1) Duty ratio=l/lO,Pulse width=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resinpackage
(Note 3) Refer to the suplement item 6. regardingthe standard rank classification. of 3-3. Derating Curve
Peak
Forward
Current
Derating
Curve
Forward
Current
Derating
Curve
120 3 E 2 E 2 80 60 100 3 L ; s = 5 $ r li
60
5o 40 30 20 10 0 -25 0 Ambient 25 50 75 `%OO Ta ("C) 125
Ambient
Temperature
Ta(`C)
Temperature
I
Peak Forward Current vs. Duty Ratio (Ta=25%1
DG996047 MODEL No. GL6ZS27
Jun/16/99 PAGE
I 4110
10 l/loo l/l0 Duty Raito 1 DR 10
3-4. Characteristics
Forward
Diagrarn(typ) (Note 1)
Current vs.Forward Voltage (Ta=25"C) Relative Luminous intensity vs. Ambient Temperature (IF=2OnA)
100
10
I iIIi
1
i /i iI
II
(),I 1
I I I I I I/i 1.2 1.4 Forward 1.6
1IIII 1.8 Voltage 2 2.2 VFW
Froward
II 2.4
11
Y
2.6
-60-40-20 Ambient
0
20 40 Temprature
60 80 Ta('C)
100 120
Relative
Luminous
lntmrity
vs.
Voltage
(Ta=25"C) 1000
100
0. 1
0.01 0. 1 Forward (Note 1) 1 Current data are 10 IF(mA) 100
Above
characteristic
typical data and not a guarantteed data.
r
DG996047
MODEL No.
Jun/16/99
PAGE
GL6ZS27
5110
4. Reliability The reliability of productsshahbe satisfiedwith itemslistedbelow. 4- 1. Test itemsandtest conditions Test items Solderability Soldering temperature Mechanicalshock Variable frequency vibration Terminalstrength (Tension) Terminal strength (Bending) Temperature cycling W' temP* `@' md humidity storage Test conditions 230+5=C, 5s Prior disposition: Dip in rosinflux 260+5"c, 5s 15 OOOm/s2, 0.5ms. 3timesI iX,*Y,dZ direction 200m/s2,100to 2 000 to lOOHz/sweep 4min. for ,4times/iX,iY,fz direction Weight:lON, Ss/each terminal Weight:SN, 0" + 90" ---f O"+ -90" + 0" /each terminal -40~(3Ot~1i1$~-+1~"c(3O111in),30 cycles Ta=+(jf)"C, g()%w, t=lt)oh Confidencelevel: 90% LTPD Samples (n) Defective (C) (o/o) n=ll, C=O n=ll,C=O n=ll. C=O n=ll. C=O n=ll, C=O n=ll, C=O n=22, C=O n=22, C=O n=22, C=O n=22. C=O n=22. C=O 20 20 20 20 20 20 10 10 10 10 10
High temperature storageTa=100"C, t=lOOOh Low temperature storageTa=-4Ot, t=lOOOh Operationlife Ta=25"C, IFMAX, t=lOOOh*3
4-2. Measurement itemsand Failurejudgementcriteria *1 Measurement Forward voltage Reversecurrent . Luminousintensity Symbol
VF
Failurejudgementcriteria *2 v, > U.S.L. x 1.2 Ia > U.S.L. x 2.0 Iv > The first stagevalueX 2.0 or The first stagevalue X 0.5 > Iv
IR
Iv
z Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. z Terminal strength : Packageis not destroyed,and terminalis not slack. * 1: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby Upper SpecificationLimit. *3: IF w.is shownby forward current of absolutemaximumratings.
DG996047 MODEL No. GL6ZS27
Jun/16/!-w
PAGE
6110
5. Incoming inspection 5-1. Applied standard IS0 2859-l : 5-2. Samplingmethodand level : A singlesampling plannormal inspectionlevel II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items,judgementcriteria andclassificaof defect
VO.
Test items
DiscoMection
judgementcriteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specificationat Vr, Ia, and Iv Exceed -0.2mm White point : Exceed o 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form : Exceed 3.Omm (on top view) Exceed d 0.3mmor O.lmm x l.Omm(on top view) Exceed 4 0.3mm (on top view) Extremely unevendensity Exceed M.25mm from packagecenter Exceed +0.2mmagainstprovided dimension Insertionpositionof terminal
classificaof defec
1 2 3 4 5 6 7 8 9 10 11 12 13
Positionof Cutting off rim Reverseterminal Outline dimensions characteristics Cut off the rim Foreign substance Scratch Void Uneven density of material for scattering Unbalancedcenter Burr Insertion positionof terminal
Major defect
Minor defect
5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria and classificaof defect No. 14 15 Test items Chappedthe surface Hollow the surface judgementcriteria The surfacechapped striking for seethe lamptop is The surfacehollow is striking for seethe lamp top class&a of defect Minor defect
DG996047 MODEL No. GL6ZS27
Jun/l6/99 PAGE 7110
6. Supplement 6-I. Packing 6-l- 1. Inner package Rut 25Gpcs the same luminous intensity rank products into pack and put following label by pack Product weight : 028g (One P~G~.Kx.,T~~.) [Indication label sample) SHIPMENT TABLE PART No. GL6ZS27 - Model number *g cl cl01700 OUANTIlY 250 + Quantity of products -a+Lotnumber* .OT No. KA99B19 a 0 069 0 Cl-Cl tLuminous intensity rank dominant wavelength rank SHARP' + Production country MADE IN JAPAN @ @ @ @ @ Production plant code(to be indicatedalphabetically) Support code Year of production(thelasttwo figures of the year) Month of production (to be indicatedalphabeticallywith Januarycorresponding A) to Date of production(Ol-3 1)
6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outer package. (approximately 670gper one outerpackage) 6-l-3. Outer packageout line dimension Width : 14Omm,Depth: 225mm, Hight: 9Omm 6-2,Luminousintensitv rank (Note 1) Rank Luminousintensity J 266 518 K 383 746 L 552 1075 M 795 ( 1548 ) (Ta=25"c) Condition IF2OmA
unit mcd
(Note 1) Tolerance:*lS% In regardto luminousintensity, the following rankingshallbe carriedout. However the quantity of eachrank shall not bepre scribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribed and lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Dominantwavelength Rank I Ta=25"C) Condition
1
Unit
(Note 2) The condition of measurementThe measurement the light emissionfrom the front sideof lamp. : of This rank value is the settingvalue of when that classifies the rank andbe not a guaranteevalue. it Also I shallnot askthe delivery ratio of eachrank.
DG996047
MODEL No.
Jun/16/!3!?
PAGE
GL6ZS27
8110
6-4. Environment M-1. Ozonosphexedestructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requks following substance. Restricted part: CFCs~~ones,CCb,Trichloroethane(Methyc~~of~) -2. Bromic non-burning materials The &vice doesn't contain bromic non-burning materials(PBBOs,PBBs)
DG996047
MODEL No.
Jud16/99
PAGE
GL6ZS27
7. Precautionsfor use
g/10
7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Whenmounting an LED lamp on a PW,do not apply physical stress to the lead pins. The lead pin pitch should match the PWE! pin-hole pitch:absolutely avoid widening or narrowing the lead pins. `Jhen positioning an LED lampbasically employ an LED with tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a PWB If the bottom face of an LED lamp is mounted directly on single-sided PWB,the base of the lead pins may be subjected to physical stress due to PWB warpcutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damageto resin etc., is found Then an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the P!B. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress.
l l
Hold dtcn
I lead farmins
pin
firmly
Good
L I
&
0 n
1. Sam
lx996047
MODEL No.
hnil6i99
PAGE
I
GL6ZS27
I
lO/lO
7 - 3. S oldering Conditions Solder the lead pins under the following conditions Type of Soldering Conditions 1. Manual soldering 295C25C) within 3 seconds 2. Wave soldering 260C+5"c, within 5 seconds 3. Auto soldering Preheating 70C to 8O"c, within 30 seconds 1 Soldering 245'C*5"c, within 5 seconds L I (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated.For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection may occur.
7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output, cleaning time,PBB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol, hlethyl alcohol, Isopropyl alcohol In case when the other solvent is us&there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition.
DG996047
MODEL No.
Judl6/9!9
PAGE
GL6ZS27
2/10
2. Outline dimensions and pin connixtions
n4. 6 f0. 2
-I-
5. 8 -CO. 2
Colorless 7
transparency
I I
n:
t
: r
ote) Unspecified tol. to be t02mm Note) Cold'iolled unit mm
I ---ET -43 '! v
Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Finish Lead : Sn plated or wave soldering
Pin connections 0. Anode 0. cathode
steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product
Drawing No. 51106028

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